Tungsten sputtering targets are made of high-purity tungsten metal, which is usually fragile and difficult to process. If tungsten is made into a very pure material, it can maintain its hardness (more than that of many steels), and it has enough ductility to make it easy to process. It is processed by forging, stretching or extrusion. Tungsten objects are also usually formed by sintering.
Of all metals in pure form, tungsten has the highest melting point (3422 °C, 6192 °F), lowest vapor pressure (at temperatures above 1650 °C, 3000 °F), and the highest tensile strength. Tungsten has the lowest coefficient of thermal expansion of any pure metal. The low thermal expansion and high melting point and tensile strength of tungsten originate from strong covalent bonds formed between tungsten atoms by the 5d electrons. Alloying small quantities of tungsten with steel greatly increases its toughness.
XK has rich experience in producing tungsten sputtering target with various shapes and purity, which are mainly applied to semi-conductive & micro-electronics. As a component of the thin-film transistors used in TFT-LCD screens, tungsten layers is extremely stable under high temperature environment, due to the highest melting point of all metals. Thanks to our special forming processes, our tungsten sputtering targets possess higher density, smaller average particle size as well as higher purity, so that you can benefit from a faster process due to higher sputtering speeds and obtain very homogeneous tungsten layers.
The microstructure can be adjusted by our flexibility production process, to achieve your desired effect. If the grains of the sputtering target are uniformly aligned, the user can benefit from constant erosion rates and homogeneous layers. Following are two micrographs of our tungsten sputtering target, the average grain size＜100μm.
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