Titanium (Ti) Sputtering Target

  • Attributes Name
    High purity metal sputtering target
  • Product Name
    Titanium Sputtering Target
  • Element Symbol
    Ti
  • Purity
    2N7, 3N5, 4N, 4N5, 5N
  • Shape
    Planar target, Rotary target
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Description
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The titanium sputtering target is made of titanium metal. As a metal, titanium is recognized for its high strength-to-weight ratio. It is a strong metal with low density that is quite ductile (especially in an oxygen-free environment), lustrous, and metallic-white in color. The relatively high melting point (more than 1,650 °C or 3,000 °F) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductivity.

Titanium sputtering targets and arc cathodes with Industrial grade are used for decorative coating to deposit golden, yellow, and golden yellow color. With up to 99.7% purity, uniform grain size, lower gas content, end user can obtain good hardness, high brightness, corrosion and oxidation resistant color without discolor and tarnish for a very long time. We have been supplying Titanium Sputtering Target or Titanium arc cathodes for manufacturers of watch, sanitary ware, car mirrors, etc, which are suitable for various magnetron sputtering machines and ionic plating machines.

High purity Titanium Sputtering Targets with up to 99.999% pure are usually used for integrated circuit, DRAMS and flat panel display application. When LSI, VLSI, and ULSI line networks are sputtered with high-purity titanium, these integrated components can be made light, thin, small in size, and dense in wiring. High purity titanium target can also be used as barrier metal material.

The microstructure can be adjusted by our flexibility production process, to achieve your desired effect. If the grains of the sputtering target are uniformly aligned, the user can benefit from constant erosion rates and homogeneous layers. Following are two micrographs of our titanium sputtering target, the average grain size<20μm.


Chemical Specification:


The chemical purity is crucial to a metal sputtering target, if the purity is higher, the films will possess a more outstanding level of electrical conductivity and minimized particle formation during the PVD process. The form below is a typical certificate of 99.995% pure Titanium Ti sputtering target:


Related Sputtering Materials


TiAlV sputtering target

WTi sputtering target

TiAl sputtering target

TiSi sputtering target

NbTi sputtering target

NiTi sputtering target

CuTi sputtering target

VTi sputtering target

TiCr sputtering target

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