Silicon Oxide(SiO2)Sputtering Target
  • Attributes Name
    Ceramic Sputtering Target
  • Product Name
    Silicon Oxide Sputtering Target
  • Element Symbol
    SiO2
  • Purity
    4N,4N5
  • Shape
    Planar target
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Description
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Xinkang can produce and supply full range of ceramic sputtering targets and compound targets, including oxide sputtering targets, carbide sputtering targets, fluoride sputtering targets, sulfide sputtering targets and so on. The production technology of ceramic sputtering targets are hot press. From the selection of raw materials to the control of temperature, pressure and time of hot press sintering, we strictly follow the specific production process, thus the finished ceramic sputtering targets have the characteristics of high purity, high density, uniform surface color without spots and crack, the end user can obtain constant erosion rates and high pure and homogeneous thin films during PVD process.

Silicon Oxide Sputtering Target;
Purity: 99.99%, 99.995%;
Production Method: hot press sintering, vacuum thermal spraying;
Available dimensions:
   Circular target: Diameter <= 14 inch, Thickness >= 3 mm;
   Rectangular target: Length <= 14 inch, Width <= 10 inch, Thickness >= 3 mm;
   Rotary target: L 4000 x Wall thickness 15mm
Minimal order quantity: 1 piece;
Type of Bonding: Indium, Elastomer;

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