Nickel sputtering target is composed of high-purity nickel metal.Nickel is a silvery-white metal with a slight golden tinge that takes a high polish. It is one of only four elements that are magnetic at or near room temperature, the others being iron, cobalt and gadolinium. Its Curie temperature is 355 °C (671 °F), meaning that bulk nickel is non-magnetic above this temperature. The unit cell of nickel is a face-centered cube with the lattice parameter of 0.352 nm, giving an atomic radius of 0.124 nm. This crystal structure is stable to pressures of at least 70 GPa. Nickel belongs to the transition metals. It is hard, malleable and ductile, and has a relatively high for transition metals electrical and thermal conductivity. The high compressive strength of 34 GPa, predicted for ideal crystals, is never obtained in the real bulk material due to the formation and movement of dislocations; however, it has been reached in Ni nanoparticles.
The highest purity of Nickel sputtering target is 99.999%, it is normally used in the semiconductor and microelectronics industries, Nickel sputtering target is the key material for semiconductor back electrodes. After repeated plastic processing, our nickel target has high density, high purity and uniform grain size. The pictures below are two micrographs of our nickel sputtering target, the average grain size＜100μm.
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