Copper sputtering target has the same properties as metal copper（Cu）.Copper is a chemical element with the symbol Cu (from Latin: cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed pure copper is pinkish-orange. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys.Copper Sputtering Target is produced by melting technology, it’s widely applied for semiconductor, decorative coating and advanced packing field.
We can produce copper sputtering target with purity of 99.9%~99.9999%, and the lowest oxygen content can be semiconductor wiring, etc. We not only produce planar copper sputtering targets (maximum G8.5 generation), but also copper rotary targets, which are mainly used for the touch screen industry. Since it is difficult to break the grain, we can only process with very large deformation and control the growth of twins to achieve a fine and uniform microstructure, which ensure a lower erosion rate and sensitivity of the formation of particles during sputtering.
Following are two micrographs of our copper sputtering target, the average grain size＜50μm
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