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Sputtering is a physical vapor deposition (PVD) process used for depositing materials onto a substrate, by ejecting atoms from sputtering targets and condensing the ejected atoms onto a substrate in a high vacuum environment.

Making a sputtering target involves several steps to create a high-quality material that can be used for thin film deposition processes. Sputtering targets are typically used in physical vapor deposition (PVD) techniques to deposit thin films onto substrates.

Custom sputtering targets are designed to meet the specific needs of a particular application. They can be made from a variety of materials, with different shapes and sizes. Custom sputtering targets are often used in research and development, as well as in industrial applications.

Sputtering targets are materials used in the process of physical vapor deposition (PVD) to deposit thin films on substrates. The choice of sputtering target depends on the specific application and the desired properties of the thin film.